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copyright ? anpec electronics corp. rev. a.3 - apr., 2001 APA4863 www.anpec.com.tw 1 anpec reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. stereo 2.2w audio power amplifier features ? ? ? ? ? depop circuitry integrated ? ? ? ? ? thermal shutdown circuitry integrated ? ? ? ? ? bridge-tied load (btl) or single-ended (se) modes operation ? ? ? ? ? output power at 1% thd+n, v dd =5v - 2.2w/ch (typ) into a 3 ? load - 1.8w/ch (typ) into a 4 ? load - 1.2 w/ch (typ) into a 8 ? load ? ? ? ? ? shutdown control mode, i sd = 0.5 a ? ? ? ? ? output power (se) at 0.5% thd+n, v dd =5v - 90mw/ch (typ.) into a 32 ? load ? ? ? ? ? various power packages available sop, tssop, tssop-p applications ? ? ? ? ? stereo audio power amplifier for notebook computer ? ? ? ? ? portable televisions ? ? ? ? ? portable and desktop computers general description ordering information the APA4863 is a stereo bridge-tied audio power am- plifier in various power packages , including sop , tssop and tssop-p . when connecting to a 5v volt- age supply , the APA4863 is capable of delivering 2.2w/1.8w/1.2w of continuous rms power per chan- nel into 3 ?/ 4 ?/ 8 ? bridge-tied loads with less than 1% thd+n respectively . when APA4863 operates in the single-ended load , it is capable of delivering 90mw of continuous rms power per channel into 32 ? load . the APA4863 simplifies design and frees up board space for other features . the APA4863 also served well in low-voltage appli- cations , which provides 750mw (1% thd+n) per channel into 4 ? loads with a 3.3v supply voltage . both of the depop circuitry and the thermal shutdown protection circuitry are integrated in the APA4863 , that reduces pops and clicks noise during power up and when using the shutdown mode and protects the chip from being destroyed by over-temperature fail- ure . to simplify the audio system design in note- book computer applications , the APA4863 combines a stereo bridge-tied loads mode for speaker drive and a stereo single-end mode for headphone drive into a single chip , where both modes are easily switched by the hp-in input control pin signal . for power sen- sitive applications , the APA4863 also features a shut- down function which keeps the supply current only 0.5 a (typ.) . package code k: sop o: tssop r: tssop-p* temp. range i : -40 to 85 c handling code tu : tube tr : tape & reel ty: tray APA4863 handling code temp. range package code * tssop-p is a standard tssop package with a thermal pad exposed on the bottom of the package.
copyright ? anpec electronics corp. rev. a.3 - apr., 2001 APA4863 www.anpec.com.tw 2 block diagram (over operating free-air temperature range unless otherwise noted.) absolute maximum ratings ring 10 4, 13 v dd 5 0? 50k ? - + - + 5 3 - in a + out a r l 100 f to hp-in circuit 8 ? 20k ? 20k ? 20k ? - + - + 12 14 + out b r l 8 ? 20k ? 20k ? 20k ? - out b - out a c o + 1k ? 100 f c o + 1k ? c s 0.1 f v dd / 2 6 c b 2.2 f 8 + in a* bypass 11 9 - in b + in b* gnd 2 , 7,15 20k ? r f 20k ? r f c 1 r 1 audio input 20k ? 1 f c 1 r 1 audio input 20k ? 1 f 16 1 100k ? shutdown hp-in to control pin on headphone jack 1 00? headphone jack sleeve control pin tip v dd * +ina and +inb pins are connected to bypass pin inside the ic. note: *1. human body model : c=100pf, r=1500 ? , 3 positive pulses plus 3 negative pulses symbol parameter rating unit v dd supply voltage 6 v t a operating ambient temperature range -40 to 85 c t j maximum junction temperature 150 c t stg storage temperature range -65 to +150 c t s soldering temperature,10 seconds 260 c v esd electrostatic discharge -2000 to 2000 *1 v
copyright ? anpec electronics corp. rev. a.3 - apr., 2001 APA4863 www.anpec.com.tw 3 min. typ. max. unit supply voltage, v dd 355.5v v dd =5v, 250mw/ch average power 4- ? stereo btl drive, with proper pcb design -20 85 operating free-air temperature, t a v dd =5v, 1.8 w/ch average power 4- ? stereo btl drive, with proper pcb design and 300 cfm forced-air cooling -20 85 c v dd =5 v 1.25 4.5 common mode input voltage, v icm v dd =3.3v 1.25 2.7 v recommended operating conditions dissipation rating table package air flow (cfm) thermal resistance ja ( c/w) t a 25 ct a =70 c so16 + 0 50 2.5w 1.6w tssop ++ 0 200 73.2 66.6 1.7w 1.8w 1.1w 1.2w tssop-p ++ 0 200 37.6 32.3 3.3w 3.8w 2.1w 2.4w + : the parameter is measured with the recommended copper heat sink pattern on an 2-layer pcb, 11.7 in 2 3.0 2.4 in 2 in pcb, 1oz. copper, 3.0 1.5 in 2 in coverage at top-layer and bottom-layer at 100% coverage (7.2in 2 ). ++:the parameter is measured with the jedec standard test boards (multi-layer pcb). APA4863 symbol parameter test conditions min. typ. max. unit v dd supply voltage 3 5.5 v i dd quiescent power supply current v in =0v, i o =0a, hp-in=0v v in =0v, i o =0a, hp-in=4v 9 5 13.5 7.5 ma i sd shutdown current v pin1 = v dd 50.5 a v ih headphone high input voltage 4 v v il headphone low input voltage 0.8 v electical characteristics electrical characteristics for entire ic the following specifications apply for v dd = 5v unless otherwise noted. limits apply for t a = 25c
copyright ? anpec electronics corp. rev. a.3 - apr., 2001 APA4863 www.anpec.com.tw 4 truth table for logic inputs shutdown hp-in APA4863 mode low low bridge -tied low high single-ended high low APA4863 shutdown high high APA4863 shutdown electical characteristics cont. APA4863 symbol parameter test conditions typ. unit v os output offset voltage v in =0v 5 mv thd=0.5%, f=1khz, r l =32 ? 90 thd=1%, f=1khz, r l =8 ? 320 p o output power thd=10%, f=1khz, r l =8 ? 400 mw thd+n total harmonic distortion plus noise a v = -1 , p o =75mw, f=1khz, r l =32 ? 0.02 % rsrr power supply rejection ratio v ripple =200mv rms , f=1khz, c b =2.2 f, r l =8 ? 49 db x talk channel separation f=1khz , c b =2.2 f, p o =32mw, r l =32 ? 85 db snr signal-to-noise ratio v dd =5v , p o =340mw, r l =8 ? 95 db electrical characteristics for se mode operation the following specifications apply for v dd = 5v unless otherwise noted. limits apply for t a = 25c electrical characteristics for btl mode operation the following specifications apply for v dd = 5v unless otherwise noted. limits apply for t a = 25c APA4863 unit symbol parameter test conditions typ. v os output offset voltage v in =0v 5 mv thd=1%, f=1khz r l =3 ? r l =4 ? r l =8 ? 2.2 1.8 1.2 p o output power thd=10%, f=1khz r l =3 ? r l =4 ? r l =8 ? 2.7 2.3 1.5 w thd+n total harmonic distortion + noise a vd =2, f=1khz r l =4 ? , p o =1.8w r l =8 ? , p o =1w 0.3 0.15 % rsrr power supply rejection ratio v dd =5v, v ripple =200mv rms , r l =8 ? c b =2.2 f 64 db x talk channel separation f=1khz , c b =2.2 f, p o =1w, r l =8 ? 90 db snr signal-to-noise ratio v dd =5v, p o =1.1w, r l =8 ? 95 db
copyright ? anpec electronics corp. rev. a.3 - apr., 2001 APA4863 www.anpec.com.tw 5 pin description 1 2 3 4 5 6 7 8 12 11 10 9 16 15 14 13 + out a shutdown gnd v dd - in a - out a gnd + in a hp-in gnd v dd - in b - out b bypass + in b + out b 1 2 3 4 5 6 7 8 12 11 16 15 14 13 + out a shutdown gnd v dd - in a - out a gnd + in a hp-in gnd v dd - in b - out b bypass + in b + out b 9 10 20 19 18 17 nc nc nc nc top view for sop top view for tssop 1 2 3 4 5 6 7 8 12 11 16 15 14 13 + out a shutdown gnd v dd - in a - out a gnd + in a hp-in gnd v dd - in b - out b bypass + in b + out b 9 10 20 19 18 17 gnd gnd gnd gnd thermal pad pin description bottom view top view for tssop -p for tssop-p name i/o description gnd ground connection of circuitry v dd i supply voltage input + ina i non-inverting input of channel a, connected to bypass pin inside the ic - ina i input pin of channel a + out a o a channel + output in btl mode, high impedance in se mode - out a o a channel - output in btl mode, + output in se mode + in b i non-inverting input of channel b, connected to bypass pin inside the ic - in b i input pin of channel b + out b o b channel + output in btl mode, high impedance in se mode - out b o b channel - output in btl mode, + output in se mode bypass connect to voltage divider for internal mid-supply bias hp-in i headphone control pin input, hold high for single-ended mode operation shutdown i shutdown mode control pin input, places entire ic in shutdown mode when held high, i dd = 0.5 a
copyright ? anpec electronics corp. rev. a.3 - apr., 2001 APA4863 www.anpec.com.tw 6 typical characteristics 10m 3 100m 1 0.01 10 0.1 1 20hz 20khz 1khz v dd =5v, r l =4 ? bw<80khz figure 1 : output power (w) figure 2 : frequency (hz) thd+n vs output power thd+n (%) 0.01 10 0.1 1 20 20k 100 1k 10k v dd =5v, p o =1.8w r l =4 ?, bw<80khz thd+n vs frequency thd+n (%) 0 0.4 0.8 1 1.2 1.4 0.6 0.2 0 0.5 1 1.5 2 2.5 0.01 10 0.1 1 20 20k 100 1k 10k a vd =10 a vd =2 v dd =5v, p o =1w r l =8 ?, btl mode figure 4 : frequency (hz) power dissipation vs output power power dissipation (w) thd+n vs frequency thd+n (%) r l =4 ? ? ? ? ? v dd =5v r l = 8 ? ? ? ? ? figure 3 : output power (w)
copyright ? anpec electronics corp. rev. a.3 - apr., 2001 APA4863 www.anpec.com.tw 7 typical characteristics cont. 0.001 10 0.1 1 20 20k 100 10k 1k v dd =5v, p o =150mw r l =16 ?, se mode a v = -5 a v = -1 0.001 10 0.1 1 20 20k 100 1k 10k v dd =5v, p o =75mw r l =32 ?, se mode a v = -5 a v = -1 figure 5 : frequency (hz) figure 6 : frequency (hz) thd+n vs frequency thd+n (%) thd+n vs frequency thd+n (%) 0.01 10 0.1 1 10m 2 100m 1 v dd =5v, r l =8 ? a vd =2, bw< 80khz btl mode f= 20hz f= 20khz f= 1khz 0.001 10 0.1 1 10m 500m 70m 200m v dd =5v, r l =16 ? a v =-1, bw< 80khz se mode f= 20hz f= 20khz f= 1khz thd+n vs output power figure 7 : output power (w) thd+n (%) thd+n vs output power figure 8 : output power (w) thd+n (%)
copyright ? anpec electronics corp. rev. a.3 - apr., 2001 APA4863 www.anpec.com.tw 8 typical characteristics cont. 0.001 10 0.1 1 10m 200m 100m 50m v dd =5v, r l =32 ? a v =-1, bw< 80khz se mode f= 20hz f= 20khz f= 1khz 10m 2 100m 1 v dd =3.3v, r l =4 ? a vd = 2 f= 20hz f= 20khz f= 1khz 0.01 10 0.1 1 figure 9 : output power (w) thd+n vs output power thd+n (%) thd+n vs output power thd+n (%) 0.01 10 0.1 1 10m 1 100m v dd =3.3v, r l =8 ? , a vd =2 f= 20hz f= 20khz f= 1khz 0.01 10 0.1 1 20 20k 100 1k 10k v dd =3.3v, p o =700mw r l =4 ? , a vd =2 thd+n vs frequency figure 11 : frequency (hz) thd+n (%) thd+n vs output power thd+n (%) figure 10 : output power (w) figure 12 : output power (w)
copyright ? anpec electronics corp. rev. a.3 - apr., 2001 APA4863 www.anpec.com.tw 9 typical characteristics cont. 0.01 10 0.1 1 20 20k 100 1k 10k v dd =3.3v, p o =450mw r l =8 ? , a vd =2 0 0.05 0.1 0.15 0.2 010203040 v dd =3.3v, f=1khz a vd =2, bw<80khz thd+n = 10% thd+n = 1% figure 13 : frequency (hz) thd+n vs frequency thd+n (%) output power vs load resistance figure 14 : load resistance ( ? ) output power (w) power dissipation vs output power output power vs supply voltage 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0 0.2 0.4 0.6 0.8 v dd =3.3v, se mode r l =8 ? r l =16 ? 0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 2 2.5 3 3.5 4 4.5 5 5.5 v dd =5v, f=1khz r l =8 ?, bw<80khz btl mode thd+n = 10% thd+n = 1% figure 15 : output power (w) power dissipation (w) figure 16 : supply voltage (v) output power (w)
copyright ? anpec electronics corp. rev. a.3 - apr., 2001 APA4863 www.anpec.com.tw 10 typical characteristics cont. 2 2.5 3 3.5 4 4.5 5 5.5 0 50 100 150 200 250 300 v dd =5v, f=1khz r l =16 ?, bw<80khz se mode thd+n = 10% thd+n = 1% 2 2.5 3 3.5 4 4.5 5 5.5 130 150 -10 10 30 50 70 90 110 v dd =5v, f=1khz r l =32 ?, bw<80khz se mode thd+n = 10% thd+n = 1% figure 17 supply voltage (v) output power vs supply voltage output power figure 18 supply voltage (v) output power vs supply voltage output power 8182838485868 0 0.25 0.5 0.75 1 1.25 1.5 1.75 v dd =5v, f=1khz a vd =2 , bw<80khz btl mode 10% thd+n 1% thd+n 0 10 20 30 40 50 60 70 0 0.2 0.4 0.6 0.8 1 v dd =5v, f=1khz a v =-1 , bw<80khz se mode 10% thd+n 1% thd+n output power vs load resistance figure 19 : load resistance ( ? ) output power (w) output power vs load resistance figure 20 : load resistance ( ? ) output power (w)
copyright ? anpec electronics corp. rev. a.3 - apr., 2001 APA4863 www.anpec.com.tw 11 typical characteristics cont. 0 0.5 1 1.5 0 0.2 0.4 0.6 0.8 1 1.2 1.4 r l =8 ? v dd =5v, f=1khz thd+n <1% bw<80khz btl mode r l =4 ? r l =32 ? r l =16 ? 0 0.1 0.2 0.3 0.4 0.5 0 0.02 0.04 0.06 0.08 0.1 0.12 0.14 0.16 0.18 r l =8 ? r l =32 ? r l =16 ? v dd =5v, f=1khz thd+n <1% bw<80khz se mode figure 21 output power (w) power dissipation vs output power power dissipation figure 22 output power (w) power dissipation vs output power power dissipation 20 20k 100 1k 10k -120 -100 -80 +0 -60 -40 -20 v dd =5v, r l =8 ? a vd =2, p o =1w c b =1 f btl mode channel b to a channel a to b 1 100 10 20 20k 100 10k v o + + v o - v o - v dd =5v, r l =8 ? a vd =2, c b =1 f 1k noise floor figure 23 : frequency (hz) output noise voltage ( v) channel separation figure 24 : frequency (hz) channel separation (db)
copyright ? anpec electronics corp. rev. a.3 - apr., 2001 APA4863 www.anpec.com.tw 12 typical characteristics cont. 20 20k 100 1k 10k -120 +0 -100 -80 -60 -40 -20 v dd =5v, r l =32 ? a v =-1, p o =75mw c b =1 f se mode channel b to a channel a to b 10m 1k 10k 100k +0 +80 +10 +20 +30 +40 +50 +60 +70 v dd =5v se mode gain phase 1m 100 channel separation figure 25 : frequency (hz) channel separation (db) open loop frequency response figure 26 : frequency (hz) gain (db) 2 2.5 3 3.5 4 4.5 5 5.5 0 2 4 6 8 10 v in =0v no load btl mode (hp-in=gnd) se mode (hp-in=v dd ) supply current vs supply voltage figure 27 : supply voltage(v) supply current (ma)
copyright ? anpec electronics corp. rev. a.3 - apr., 2001 APA4863 www.anpec.com.tw 13 packaging information tssop/ tssop-p ( reference jedec registration mo-153) millimeters inches dim min. max. min. max. a 1.2 0.047 a1 0.00 0.15 0.000 0.006 a2 0.80 1.05 0.031 0.041 d 6.4 (n=20pin) 7.7 (n=24pin) 6.6 (n=20pin) 7.9 (n=24pin) 0.252 (n=20pin) 0.303 (n=24pin) 0.260 (n=20pin) 0.311 (n=24pin) d1 2.20 (n=20pin) 2.70 (n=24pin) thermally enhanced 0.087 (n=20pin) 0.106 (n=24pin) thermally enhanced e 0.65 bsc 0.026 bsc e 6.40 bsc 0.252 bsc e1 4.30 4.50 0.169 0.177 e2 1.50 0.059 l 0.45 0.75 0.018 0.030 l1 1.0 ref 0.039ref r 0.09 0.004 r1 0.09 0.004 s 0.2 0.008 8 0 8 212 ref 12 ref ref 12 ref e2 bottom view (thermally enhanced variationds only) b d1 a1 a2 a d e 2 x e / 2 e1 e e/2 n 12 3 exposed thermal pad zone l (l1) (3) r r1 s (2) 0.25 gauge plane 1
copyright ? anpec electronics corp. rev. a.3 - apr., 2001 APA4863 www.anpec.com.tw 14 packaging information so ? 300mil ( reference jedec registration ms-013) millimeters variations- d inches variations- d dim min. max. variations min. max. dim min. max. variations min. max. a2.35 2.65 so-16 10.10 10.50 a 0.093 0.1043 so-16 0.398 0.413 a1 0.10 0.30 so-18 11.35 11.76 a1 0.004 0.0120 so-18 0.447 0.463 b 0.33 0.51 so-20 12.60 13 b 0.013 0.020 so-20 0.496 0.512 d see variations so-24 15.20 15.60 d see variations so-24 0.599 0.614 e 7.40 7.60 so-28 17.70 18.11 e 0.2914 0.2992 so-28 0.697 0.713 e1.27bscso-14 8.80 9.20 e 0.050bsc so-14 0.347 0.362 h 10 10.65 h 0.394 0.419 l 0.40 1.27 l 0.016 0.050 n see variations n see variations 10 8 10 8 n 12 3 e h d l gauge plane 1 e b a1 a
copyright ? anpec electronics corp. rev. a.3 - apr., 2001 APA4863 www.anpec.com.tw 15 reference jedec standard j-std-020a april 1999 reflow condition (ir/convection or vpr reflow) physical specifications pre-heat temperature 183 c peak temperature time temperature classification reflow profiles convection or ir/ convection vpr average ramp-up rate(183 c to peak) 3 c/second max. 10 c /second max. preheat temperature 125 25 c) 120 seconds max temperature maintained above 183 c 60 ? 150 seconds time within 5 c of actual peak temperature 10 ?20 seconds 60 seconds peak temperature range 220 +5/-0 c or 235 +5/-0 c 215-219 c or 235 +5/-0 c ramp-down rate 6 c /second max. 10 c /second max. time 25 c to peak temperature 6 minutes max. package reflow conditions pkg. thickness ? 2.5mm and all bgas pkg. thickness < 2.5mm and pkg. volume ? 350 mm3 pkg. thickness < 2.5mm and pkg. volume < 350mm3 convection 220 +5/-0 c convection 235 +5/-0 c vpr 215-219 c vpr 235 +5/-0 c ir/convection 220 +5/-0 c ir/convection 235 +5/-0 c terminal material solder-plated copper (solder material : 90/10 or 63/37 snpb) lead solderability meets eia specification rsi86-91, ansi/j-std-002 category 3. pac k a g i n g 2 0 0 0 dev i c es per r e e l
copyright ? anpec electronics corp. rev. a.3 - apr., 2001 APA4863 www.anpec.com.tw 16 application a b c j t1 t2 w p e sop-16w 330 3100 2 13 + 0.5 2 0.5 16.4 +0.3 -0.2 2.5 0.5 16 0.2 12 0.1 1.75 0.1 application f d d1 po p1 ao bo ko t sop-16w 7.5 0.1 1.5 +0.1 1.5 +0.25 4.0 0.1 2.0 0.1 10.9 0.1 10.8 0.1 3.0 0.1 0.3 0.013 (mm) carrier tape & reel dimensions a j b t2 t1 c t ao e w po p ko bo d1 d f p1 cover tape dimensions carrier width 16 cover tape width 13.3 (mm) reliability test program test item method description solderability mil-std-883d-2003 245 c , 5 sec holt mil-std-883d-1005.7 1000 hrs bias @ 125 c pct jesd-22-b, a102 168 hrs, 100 % rh , 121 c tst mil-std-883d-1011.9 -65 c ~ 150 c, 200 cycles esd mil-std-883d-3015.7 vhbm > 2kv, vmm > 200v latch-up jesd 78 10ms , i tr > 100ma
copyright ? anpec electronics corp. rev. a.3 - apr., 2001 APA4863 www.anpec.com.tw 17 analog and power electronics corp. head office : 5f, no. 2 li-hsin road, sbip, hsin-chu, taiwan, r.o.c. tel : 886-3-5642000 fax : 886-3-5642050 taipei branch : 24f-1. no. 268, sec. 2, peihsin rd. hsindian, taipei county, taiwan, r. o. c. tel : 886-2-86658533 fax : 886-2-86658529 customer service

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